The
Meridian is designed for use in high volume environments where throughput
is the primary concern. The modular head on the Meridian is designed for chip
and small IC type component placements. The Meridian has a precision head
to that extends the component range to include large and fine pitch component
placements. The Meridian has the capability to accurately place both chip
and IC components at placement rates as high as 28,000 CPH.
