We offer high-speed SMT pick and place lines with placement rates of up to 54,000 cph. Our capabilities include placement of all SMT devices, including micro BGA, CSP, flip chip, COB and 0201 components.
8-12-zone convection ovens and automated inspection systems enhance each line.

We have a complete through hole assembly department, including smartwave solder in both leaded and lead free technologies and a Hydro aqueous wash system, as well as complete chassis box build assembly lines.